MEMS and NEMS structures, components, devices and systems

 

Group leaders: Žarko Lazić, Milče M. Smilјanić

The group deals with the fundamental concepts, design, fabrication and testing of structures, components, devices and systems. This includes concept, design and fabrication of MEMS and NEMS sensor and actuator chips, as well as the development of specific procedures in planar technologies and micromachining.

 

Topics
MEMS sensors
MEMS a
ctuators
Piezo
resistive pressure sensors
  - MEMS low pressure sensor chip for elevated operating temperatures up to 3000C 
  - MEMS pressure sensor chip with built-in overpressure protection

Multipurpose MEMS sensors based on Zeebeck effect

Inertial sensors

MEMS microreactors 

Microactuators 

silicon PIN photodiodes