Microsystem and Nanosystem Technologies at CMT

  • Design and fabrication of photolithographic masks
  • photolithography
  • planar technologies (diffusion, oxidation)
  • thin film deposition (RF sputtering)
  • bulk and surface micromachining of silicon
  • wafer bonding
  • epitaxial thin film growth
  • scanning probe nanolithography
  • Wafer dicing
  • bonding and encapsulation

 Characterization methods

  • Atomic force microscopy
  • FTIR spectrophotometry (0.8-27 micrometer)
  • FTIR microscopy (2-27 micrometer, 50 x 50 micrometer)
  • UV-vis spectrophotometry
  • Environmental chamber testing
  • Profilometer thickness control
  • Absolute and gauge pressure, pressure difference, level transmitter calibration (certified lab for Ex-proof devices)
  • Blackbody measurements
  • Photodetector characterization (incl. sensitivity, NEP, D*)
  • Response time measurements
  • Lifetime & burn-in tests for semiconductor devices
  • Capacitance-voltage measurements
  • Large volume in-chip device testing (automatic prober)
  • High magnetic fields & cryogenic measurements
  • Photoacoustic characterization