Silicon PIN photodiodes

We produce PIN photodiodes on n-type and p-type substrate, standard and quadrant, with active areas from 0.8 mm2 to 80 mm2 (other sizes on request).

n-type Photodiodes

Our n-type silicon PIN photodiodes are optimized for detection of radiation at 900 nm. A photodiode illuminated by visible and near infrared light behaves as a current source with photocurrent proportional to the power of detected radiation. Reverse bias increases parallel internal resistance and decreases capacity of diode. Decrease of capacity and of load resistance RL decreases response time. Low capacity with relatively low bias is achieved by using extremely pure, high resistance silicon for the base I-region of the diode (> 2 kΩcm). Background radiation flux increases noise current, thus filters or darkening are recommanded to decrease this radiation.

 

 

FD08N

FD5N
FD5N1

FD80N

Type

 

N

N

N

Active area (mm2)

 

0.8

5

80

Housing

 

TO-18

TO-5

TO-25

Supply voltage (V)

 

45

45

45

Breakdown voltage (V)

 

100

100

100

Dark current (nA)

typical

2

20

50

max

20

50

300

Responsivity (A/W)

900 nm typical

0.60

0.60

0.60

900 nm min.

0.50

0.50

0.50

1060 nm typical

0.15

0.15

0.15

1060 nm min.

0.10

0.10

0.10

NEP (10-12Hz1/2)

900 nm typical

<1

<1.5

5

900 nm max

5

7

20

1060 nm typical

<4

<4

20

1060 nm max.

20

20

80

Capacity (pF)

typical

2.5

8

70

max

3

10

120

Response (ns)

900 nm

31)

51)

101)

1) at 50% of amplitude

 

Download pdf versions of data sheets for our n-type diodes:

n-type Si PIN diode, active area 0.8 mm2
n-type Si PIN diode, active area 5 mm2, standard height or with a low-cap housing
n-type Si PIN diode, active area 80 mm2

 

p-type Photodiodes

Our p-type silicon PIN photodiodes are optimized for detection of radiation at 1060 nm. A photodiode illuminated by visible and near infrared light behaves as a current source with photocurrent proportional to the power of detected radiation. Reverse bias increases parallel internal resistance and capacity of diode. Decrease of capacity and of load resistance RL decreases response time. Low capacity with relatively low bias is achieved by using extremely pure, high resistance silicon for the base I-region of the diode (> 10 kΩcm). Background radiation flux increases noise current, thus filters or darkening are recommanded to decrease this radiation. Influences of transition area width and cross-talk influence are minimized for our quadrant-type PIN diodes.

 

 

 

FD5P
FD5P1

QDY7P 3)

QDY80P 3)

Type

 

P

P

P

Active area (mm2)

 

5

7

80

Housing

 

TO-5

TO-5, 8

TO-25

Supply voltage (V)

 

200

200

200

Breakdown voltage (V)

 

250

250

250

Dark current (nA)

Typical

20

10

100

max

100

50

1000

Responsivity (A/W)

900 nm typical

0.60

0.60

0.60

900 nm min.

0.50

0.50

0.50

1060 nm typical

0.45

0.45

0.45

1060 nm min.

0.40

0.40

0.40

NEP (10-12Hz1/2)

900 nm typical

<1.5

<1.5

5

900 nm max

10

7

40

1060 nm typical

<2.5

<2.5

7

1060 nm max.

15

12

60

Capacity (pF)

typical

2.5

1.2

7

max

3

1.4

10

Response (ns)

1060 nm

<112)

<112)

<202)

2) 10% - 90% of amplitude
3) per quadrant

 

Download pdf versions of data sheets for our p-type diodes:

p-type Si PIN diode, active area 5 mm2, standard height or with a low-cap housing
quadrant p -type Si PIN diode, active area 7 mm2
quadrant p -type Si PIN diode, active area 80 mm2